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Compatibilizer

BT-362

Core-shell structures enable low-temperature toughening in PBT, PC/ABS, etc.

  • Chemical name :

    Butadiene and acrylate copolymer with a core-shell structure
  • Appearance :

    White powder
  • Melting Point :

    150 ℃
  • Recommended Dosage :

    3-15phr
  • Processing Temperature :

    160-300℃

Scope of application

BT-362 is mainly used in PC/ABS alloy or other engineering plastic systems that require high impact resistance and are transparent or translucent:

   Base material:

o    Transparent engineering plastics: PC (polycarbonate), transparent ABS, PMMA (acrylic) and its alloys (such as PC/ABS).

o    Non-transparent engineering plastics: PVC (hard/soft), PET

(polyethylene terephthalate), PBT (polybutylene terephthalate).

.   Processing: injection molding (electronic housings, transparent covers),  extrusion molding (plates, tubes), blow     molding (transparent containers).

.   End-use applications:

o    Electronic appliances: cell phone/laptop shells, charger plugs (high gloss, drop resistant).

o    Optical components: instrument windows, LED lampshades (light transmittance>85%).

o    Daily necessities: transparent storage boxes, toys (both toughness and beauty).

o    Medical devices: transparent infusion tubes, testing equipment shells (chemical resistance, impact resistance).

 

Function and purpose

.   Toughening modification:

o     Significantly improve impact strength.

o     Improvement of low temperature toughness. 

            .   Surface optimization:

o     Enhance the surface gloss of products.

o     Reduces processing defects such as silver lines and fusion marks.

               .   Processability improvement:

o     Reduce melt viscosity and improve injection filling efficiency.

 

Product performance

 

Product data

 

 

 

 

Product

Specification

 

BT-362

 

 

Test Items

 

Standard

Unit

Measurement Method

1

Appearance

White powder

/

/

2

Volatile

substance

≤1%

% of volatile substances

/

 

3

20 mesh sieve residue %

 

≤2

% / ≤2% 20 mesh sieve  residue % 3

 

/ ≤1

 

PC/ABS alloy modification

 

 

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